VPC Products

Hybrid Type

  • Pad Array : Full
  • Contact Pad : Solder bump / Pad / CuPillar and others
  • Pitch : ≥80um
  • Pin Counts : ≤ 5,000
  • CCC : 850mA (R.T)
  • STF : MLC / MLO / WST
  • WST : ≤ 6000 (Wire Counts)
  • Application : SoC (Magnetic / Optical)
  • Tester : U-Flex / J750 / T2000 / V93K 9.5" / V93K 12" / V93K Direct-Dock /Magnum SV / V5400 / ND1~3 / ETC

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